Reaction analysis in stripline circuits

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 3, 2001, Pages 347-356

  Kabir, Sutirtha ^a,b   Dvorak, Steven L ^a,c   Prince, John L ^a,c  

^a IEEE   (United States)

^b MOTOROLA INC   (United States)

^c University of Arizona   (United States)

Author keywords

Full wave; Integral equation; Interconnects; Method of moments; Stripline

Indexed keywords

FULL WAVE LAYERED INTERCONNECT SIMULATOR; STRIPLINE CIRCUITS; STRIPLINE STRUCTURE;

BOUNDARY CONDITIONS; COMPUTER SIMULATION; ELECTROMAGNETIC FIELD EFFECTS; ELECTRONICS PACKAGING; GREEN'S FUNCTION; INTEGRAL EQUATIONS; INTEGRATED CIRCUIT LAYOUT; METHOD OF MOMENTS; SCATTERING PARAMETERS;

INTEGRATED CIRCUITS;

EID: 0035421963     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.938302     Document Type: Article

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