Reduction of crosstalk noise in modulator Jack for high-speed differential signal interconnection

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 3, 2001, Pages 260-267

  Kim, Namhoon ^a,b   Sung, Myunghee ^a,b   Kim, Hyungsoo ^a,b   Back, Seungyong ^a,b   Ryu, Woonghwan ^a,b   An, Jeong Gyun ^a,c   Kim, Joungho ^a,b  

^a Korean Advanced Institute of Science and Technology ^*

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^c KT Cooperation   (South Korea)

Author keywords

Category 5E; Compensation; Coupling; Crosstalk; Embedded capacitor; Modular jack; UTP

Indexed keywords

CAPACITORS; ELECTRIC CABLES; ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; SPURIOUS SIGNAL NOISE;

CROSSTALK NOISE; HIGH SPEED DIFFERENTIAL SIGNAL INTERCONNECTION; NEAR END CROSSTALK; UNSHIELDED TWIST PAIR CABLE;

CROSSTALK;

EID: 0035421322     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.938292     Document Type: Article

References (15)

1. The importance of inductance and inductive coupling for on-chip wiring
2. An efficient crosstalk parameter extraction method for high-speed interconnection lines
3. High-definition television: Assessing demand forecasts for a next generation consumer durable
4. Innovation diffusion and new product growth models in marketing
5. Figure of merit to characterize the importance of on-chip inductance
6. When are transmission-line effects important for on-chip interconnections?