SCOPUS 정보 검색 플랫폼

Volumn 145, Issue 1-3, 2001, Pages 215-225

Improved characteristics of electroless Cu deposition on Pt-Ag metallized Al2O3 substrates in microelectronics packaging

(3) Young, C C a Duh, J G a Huang, C S a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Adhesion strength; Electroless Cu; Recrystallization; Solder leaching; Thermal aging

Indexed keywords

ADHESION; AGING OF MATERIALS; COPPER; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; ELECTRONICS PACKAGING; LEACHING; METALLIZING; RECRYSTALLIZATION (METALLURGY); SOLDERING;

MICROELECTRONICS PACKAGING;

ELECTROLESS PLATING;

CERAMIC COATING;

EID: 0035415515 PISSN: 02578972 EISSN: None Source Type: Journal
DOI: 10.1016/S0257-8972(01)01270-1 Document Type: Article

Times cited : (13)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.