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Volumn 92, Issue 8, 2001, Pages 986-994
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Grain growth in the nanocrystalline W - Cu and Cu - Pb composite powders prepared by mechanical alloying
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Author keywords
Composite powder; Grain growth; Mechanical alloying; Nanocrystalline W Cu and Cu Pb
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Indexed keywords
ACTIVATION ENERGY;
COPPER ALLOYS;
DIFFERENTIAL SCANNING CALORIMETRY;
GRAIN GROWTH;
GRAIN SIZE AND SHAPE;
MECHANICAL ALLOYING;
METAL MELTING;
NANOSTRUCTURED MATERIALS;
SCANNING ELECTRON MICROSCOPY;
THERMODYNAMIC STABILITY;
TRANSMISSION ELECTRON MICROSCOPY;
X RAY DIFFRACTION ANALYSIS;
COMPOSITE POWDERS;
GRAIN GROWTH PARAMETER;
MELTING POINT SUPPRESSION;
TUNGSTEN ALLOYS;
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EID: 0035415261
PISSN: 00443093
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (12)
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References (41)
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