-
1
-
-
0026407176
-
Plasma Displays
-
A. Sobel, "Plasma Displays," IEEE Trans. Plasma Sci., 19 [6] 1032-47 (1991).
-
(1991)
IEEE Trans. Plasma Sci.
, vol.19
, Issue.6
, pp. 1032-1047
-
-
Sobel, A.1
-
2
-
-
0033906924
-
Development of Panel Structure for a High-Resolution 21-in.-Diagonal Full-Color Surface-Discharge Plasma Display Panel
-
T. Shinoda, M. Wakilami, T. Nanto, and N. Awaji, "Development of Panel Structure for a High-Resolution 21-in.-Diagonal Full-Color Surface-Discharge Plasma Display Panel," IEEE Trans. Electr. Devices, 47 [1] 77-81 (2000).
-
(2000)
IEEE Trans. Electr. Devices
, vol.47
, Issue.1
, pp. 77-81
-
-
Shinoda, T.1
Wakilami, M.2
Nanto, T.3
Awaji, N.4
-
3
-
-
0004031596
-
-
U.S. Pat. No. 6 008 582, 1999
-
M. Asano, Y. Tsuruoka, and H. Tanabe, "Plasma Display Device with Auxiliary Partition Walls Corrugated, Tiered, and Pigmented Wall," U.S. Pat. No. 6 008 582, 1999.
-
Plasma Display Device with Auxiliary Partition Walls Corrugated, Tiered, and Pigmented Wall
-
-
Asano, M.1
Tsuruoka, Y.2
Tanabe, H.3
-
4
-
-
0004203325
-
-
Japan Pat. Application No. 09278920, 1997
-
M. Koichiro, K. Yushuhiro, M. Shigekazu, and O. Haruhiko, "Barrier Rib Forming Method for Plasma Display Panel and Its Material," Japan Pat. Application No. 09278920, 1997.
-
Barrier Rib Forming Method for Plasma Display Panel and Its Material
-
-
Koichiro, M.1
Yushuhiro, K.2
Shigekazu, M.3
Haruhiko, O.4
-
6
-
-
0003802321
-
-
U.S. Pat. No. 6 043 604, 2000
-
K. Horiuchi, Y. Iguchi, T. Masaki, and G. Moriya, "Plasma Display with Barrier Rib of Specific Construction," U.S. Pat. No. 6 043 604, 2000.
-
Plasma Display with Barrier Rib of Specific Construction
-
-
Horiuchi, K.1
Iguchi, Y.2
Masaki, T.3
Moriya, G.4
-
9
-
-
0001287745
-
The Role of Slip Additives in Tape-Casting Technology
-
R. Moreno, "The Role of Slip Additives in Tape-Casting Technology," Am. Ceram. Soc. Bull., 71 [11] 1647-57 (1992).
-
(1992)
Am. Ceram. Soc. Bull.
, vol.71
, Issue.11
, pp. 1647-1657
-
-
Moreno, R.1
-
10
-
-
0344671623
-
Tape Casting of High Dielectric Ceramic Composite Substrates for Microelectronics Application
-
A. I. Y. Tok, F. Y.C. Boey, and K. A. Kor, "Tape Casting of High Dielectric Ceramic Composite Substrates for Microelectronics Application," J. Mater. Process., 89-90, 508-12 (1999).
-
(1999)
J. Mater. Process.
, vol.89-90
, pp. 508-512
-
-
Tok, A.I.Y.1
Boey, F.Y.C.2
Kor, K.A.3
-
11
-
-
0029220748
-
Tape Casting: Relationship between Organic Constituents and the Physical and Mechanical Properties of Tapes
-
M. Descamps, R. Ringnet, D. Leger, and B. Thierry, "Tape Casting: Relationship between Organic Constituents and the Physical and Mechanical Properties of Tapes," J. Eur. Ceram. Soc., 15, 357-62 (1995).
-
(1995)
J. Eur. Ceram. Soc.
, vol.15
, pp. 357-362
-
-
Descamps, M.1
Ringnet, R.2
Leger, D.3
Thierry, B.4
-
12
-
-
0024610668
-
Particle Orientation during Tape Casting in the Fabrication of Grain-Oriented Bismuth Titanate
-
H. Watanabe, T. Kimura, and T. Yamaguchi, "Particle Orientation during Tape Casting in the Fabrication of Grain-Oriented Bismuth Titanate," J. Am. Ceram. Soc., 72 [2] 289-93 (1989).
-
(1989)
J. Am. Ceram. Soc.
, vol.72
, Issue.2
, pp. 289-293
-
-
Watanabe, H.1
Kimura, T.2
Yamaguchi, T.3
-
13
-
-
0003944113
-
-
Wiley, New York
-
R. B. Bird, W. E. Stewart, and E. N. Lightfoot, Transport Phenomena; p. 64. Wiley, New York, 1960.
-
(1960)
Transport Phenomena
, pp. 64
-
-
Bird, R.B.1
Stewart, W.E.2
Lightfoot, E.N.3
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