Tape casting of high dielectric ceramic composite substrates for microelectronics application

Journal of Materials Processing Technology

Volumn 89-90, Issue , 1999, Pages 508-512

  Tok, Alfred I Y ^a   Boey, Freddy Y C ^a   Khor, K A ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CASTING; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; MULTILAYERS; SUBSTRATES;

MULTILAYER CAPACITOR; MULTILAYER CERAMIC PACKAGES; TAPE CASTING; TAPE THICKNESS;

CERAMIC MATRIX COMPOSITES;

EID: 0344671623     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(99)00131-4     Document Type: Article

References (12)

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