Application-specific economic analysis of integral passives in printed circuit boards

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 24, Issue 3, 2001, Pages 203-213

  Sandborn, Peter A ^a,b   Etienne, Bevin ^b   Subramanian, Gowrishankar ^b  

^a IEEE   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Cost analysis; Embedded passives; Integral passives; Technology tradeoff analysis

Indexed keywords

DISCRETE PASSIVE COMPONENTS;

CAPACITORS; ELECTRIC WIRING; ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS; RESISTORS;

PRINTED CIRCUIT MANUFACTURE;

EID: 0035401662     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.956806     Document Type: Article

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