MicroJet printing of solder and polymers for multi-chip modules and chip-scale packages

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3830, Issue , 1999, Pages 242-247

  Hayes, Donald J ^a   Wallace, David B ^a   Cox, W Royall ^a  

^a MICROFAB TECHNOLOGIES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; JETS; LEAD ALLOYS; MICROPROCESSOR CHIPS; MULTICHIP MODULES; POLYMERS; PRINTED CIRCUIT MANUFACTURE; SOLDERING ALLOYS; THERMAL EFFECTS; TIN ALLOYS;

CHIP SCALE PACKAGE; MICROJET PRINTING; PRINT ON THE FLY PRINTING PLATFORMS; PRINTHEAD; SOLDER INTERCONNECTS;

PRINTING;

EID: 0033365796     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)