|
Volumn 21, Issue 7, 2001, Pages 959-968
|
SiCN nanocomposite: Creep behaviour
|
Author keywords
Creep; Nanocomposite; Si3N4; Si3N4 SiC
|
Indexed keywords
ALUMINA;
ENTHALPY;
GLASS TRANSITION;
GRAIN BOUNDARIES;
NANOSTRUCTURED MATERIALS;
SILICON;
SINTERING;
STRESSES;
YTTRIUM COMPOUNDS;
CREEP RESISTANCE;
CREEP TESTING;
COMPOSITE;
CREEP;
FORGING;
HIGH TEMPERATURE APPLICATION;
SILICON NITRIDE;
|
EID: 0035399834
PISSN: 09552219
EISSN: None
Source Type: Journal
DOI: 10.1016/S0955-2219(00)00286-7 Document Type: Article |
Times cited : (13)
|
References (37)
|