Dielectric breakdown distributions for void containing silicon substrates

Microelectronics Reliability

Volumn 41, Issue 7, 2001, Pages 967-971

  Falster, R ^a   Bonoli, F ^a   Voronkov, V V ^b  

^a MEMC Electronic Materials SpA   (Italy)

^b MEMC Electronic Materials   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; EXTRAPOLATION; MATHEMATICAL MODELS; SUBSTRATES; WEIBULL DISTRIBUTION;

DIELECTRIC BREAKDOWN DISTRIBUTIONS; LOW-SERIES RESISTANCE CAPACITOR STRUCTURES;

SILICON WAFERS;

EID: 0035394092     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00048-8     Document Type: Article

References (5)