Deposition rate and thickness uniformity of thin films deposited by a pulsed cathodic arc process

Surface and Coatings Technology

Volumn 142-144, Issue , 2001, Pages 655-660

  Fuchs, H ^a   Engers, B ^b   Hettkamp, E ^a   Mecke, H ^a   Schultz, J ^b  

^a OTTO VON GUERICKE UNIVERSITY   (Germany)

^b Angaris GmbH   (Germany)

Author keywords

Deposition rate; Film thickness uniformity; Ion current density; Pulsed arc; Vacuum arc

Indexed keywords

CATHODES; CURRENT DENSITY; DEPOSITION; THICKNESS CONTROL;

DEPOSITION RATES;

THIN FILMS;

CATHODIC ARC PLASMA DEPOSITION;

EID: 0035387788     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(01)01114-8     Document Type: Article

References (16)

1. Comparison of substrate temperature and deposition rate between modified pulsed are process and d.c. arc process