Effect of the fourth element on bonding of silicon nitride ceramics with Y2O3-Al2O3-SiO2 glass solders

Journal of Rare Earths

Volumn 19, Issue 2, 2001, Pages 90-96

  Zhou, F ^a  

^a JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Bonding; Oxynitride glass; Rare earths; Si3N4 ceramic; Titanium oxide; Yttria

Indexed keywords

MICROSTRUCTURE; SILICON NITRIDE; SOLDERING; SURFACE CHEMISTRY; THERMAL STRESS; TITANIUM OXIDES;

FOUR POINT BENDING TESTS; INTERFACIAL REACTION; JOINT STRENGTH; OXYNITRIDE GLASS; YTTRIA;

BONDING;

EID: 0035354780     PISSN: 10020721     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)

1. Progress in joining of silicon nitride ceramic
2. Refractory oxynitride joints in silicon nitride
3. Silicon nitride joining
4. Liquid-phase bonding of silicon nitride ceramics
5. 2
6. Silicon nitride joining with silicate glass solder
7. 2 glass solder
8. p ceramic composite
9. 2 glass solders
10. 4 bonding
11. Study on the interfacial reaction and bonding strength in liquid phase bonding of silicon nitride and their multi-phase ceramics
12. 2
13. Preparation and properties of oxynitride glasses
14. 2O powder
15. 2O system
16. Control of phase composition in Ó-β́-Sialon multi-phase ceramic
17. Joining Sialon ceramics using composite β-Sialon-glass adhesives