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Volumn 46, Issue 7, 1998, Pages 2393-2399

Refractory oxynitride joints in silicon nitride

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; INTERDIFFUSION (SOLIDS); INTERFACES (MATERIALS); JOINING; MECHANICAL TESTING; PHASE COMPOSITION; POSITIVE IONS; REFRACTORY MATERIALS; SINTERING;

EID: 0032036223     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(98)80021-9     Document Type: Article
Times cited : (34)

References (16)
  • 3
    • 85033903084 scopus 로고
    • Application of the partial transient liquid phase bonding method for joining silicon nitride ceramics
    • October 2-76, in Riccione, Italy
    • Ceccone, X., et al., Application of the Partial Transient Liquid Phase Bonding Method for Joining Silicon Nitride Ceramics, presented at ECER'S 95, October 2-76, 1995 in Riccione, Italy.
    • (1995) ECER'S 95
    • Ceccone, X.1
  • 13
    • 85033885645 scopus 로고    scopus 로고
    • MS Thesis, Silicon Nitride Joining Using a Sr-Celsian-Based Glass Interlayer, University of New Mexico, July
    • Quillen, B. G., MS Thesis, Silicon Nitride Joining Using a Sr-Celsian-Based Glass Interlayer, University of New Mexico, July 1996.
    • (1996)
    • Quillen, B.G.1
  • 16
    • 85033899416 scopus 로고    scopus 로고
    • to be published
    • Quillan, B., et al., to be published.
    • Quillan, B.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.