Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 350°C

Journal of Nuclear Materials

Volumn 295, Issue 1, 2001, Pages 1-15

  Singh, B N ^a   Edwards, D J ^b   Eldrup, M ^a   Toft, P ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b Materials Development Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGE HARDENING; ANNEALING; BONDING; DISPERSIONS; ELECTRIC CONDUCTIVITY OF SOLIDS; METALLOGRAPHIC MICROSTRUCTURE; NEUTRON IRRADIATION; STRENGTHENING (METAL); TENSILE TESTING; TERNARY SYSTEMS; THERMAL CYCLING;

DISPERSION STRENGTHENING;

COPPER ALLOYS;

EID: 0035339056     PISSN: 00223115     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-3115(01)00507-4     Document Type: Article

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