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Volumn 258-263, Issue PART 1 A, 1998, Pages 978-984
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The effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100°C
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Author keywords
[No Author keywords available]
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Indexed keywords
AGING OF MATERIALS;
DUCTILITY;
ELECTRIC CONDUCTIVITY OF SOLIDS;
EXPERIMENTAL REACTORS;
HEAT SINKS;
HEAT TREATMENT;
NEUTRON IRRADIATION;
TENSILE TESTING;
THERMAL CYCLING;
THERMAL EFFECTS;
REACTOR BAKEOUT TREATMENT;
COPPER ALLOYS;
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EID: 0032182025
PISSN: 00223115
EISSN: None
Source Type: Journal
DOI: 10.1016/S0022-3115(98)00388-2 Document Type: Article |
Times cited : (16)
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References (11)
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