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Volumn 258-263, Issue PART 1 A, 1998, Pages 978-984

The effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100°C

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DUCTILITY; ELECTRIC CONDUCTIVITY OF SOLIDS; EXPERIMENTAL REACTORS; HEAT SINKS; HEAT TREATMENT; NEUTRON IRRADIATION; TENSILE TESTING; THERMAL CYCLING; THERMAL EFFECTS;

EID: 0032182025     PISSN: 00223115     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-3115(98)00388-2     Document Type: Article
Times cited : (16)

References (11)
  • 1
    • 30244450722 scopus 로고
    • ITER Joint Central Team, J. Nucl. Mater. 212-215 (1994) 3.
    • (1994) J. Nucl. Mater. , vol.212-215 , pp. 3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.