SCOPUS 정보 검색 플랫폼

Volumn 11, Issue 3, 2001, Pages 239-244

Micromachining of multi-thickness sensor-array structures with dual-stage etching technology

Author keywords

[No Author keywords available]

Indexed keywords

SENSOR ARRAYS;

ANISOTROPY; ARRAYS; ETCHING; MICROSENSORS; PARTIAL PRESSURE SENSORS; THICKNESS MEASUREMENT;

MICROMACHINING;

EID: 0035337209 PISSN: 09601317 EISSN: None Source Type: Journal
DOI: 10.1088/0960-1317/11/3/313 Document Type: Article

Times cited : (7)

References (9)

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- Petersen, K.E.¹

2
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- Bao M, Yu L and Wang Y 1990 Micromachined beam-diaphragm structure improves performances of pressure transducer Sensors Actuators A 21-23 137
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- Bao, M.¹ Yu, L.² Wang, Y.³

3
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- Capacitive silicon accelerometer with highly symmetrical design
- Seidel H, Riedel H, Kolbeck R, Muck G, Kupke W and Koniger M 1990 Capacitive silicon accelerometer with highly symmetrical design Sensors Actuators A 21-23 314
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- Seidel, H.¹ Riedel, H.² Kolbeck, R.³ Muck, G.⁴ Kupke, W.⁵ Koniger, M.⁶

4
- 0005641159
- Problems encountered in the development of a microscale g-switch using three design approaches
- Robinson C 1987 Problems encountered in the development of a microscale g-switch using three design approaches Tech. Digest of the 4th Int. Conf. on Solid-State Sensors and Actuators, Transducers'87 (Japan, June 1987) p 410
- (1987) Tech. Digest of the 4th Int. Conf. on Solid-state Sensors and Actuators, Transducers'87 (Japan, June 1987) , pp. 410
- Robinson, C.¹

5
- 0026366623
- Design considerations of a digital pressure sensor array
- Bower R and Ismail M 1991 Design considerations of a digital pressure sensor array Tech. Digest of the 6th Int. Conf. on Solid-State Sensors and Actuators, Transducers'91 (CA, USA, June 1991) p 312
- (1991) Tech. Digest of the 6th Int. Conf. on Solid-state Sensors and Actuators, Transducers'91 (CA, USA, June 1991) , pp. 312
- Bower, R.¹ Ismail, M.²

6
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7
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- Terracing of (100) Si with one mask and one etching step using misaligned V-grooves
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- Vangbo, M.¹ Backlund, Y.²

8
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- Fabrication of bulk-si microstructures using a trench-assisted etch-stop process
- Parviz B and Najafi K 1999 Fabrication of bulk-si microstructures using a trench-assisted etch-stop process Tech. Digest of the 10th Int. Conf. on Solid-State Sensors and Actuators (Sendai, Japan, 7-10 June 1999) p 534
- (1999) Tech. Digest of the 10th Int. Conf. on Solid-state Sensors and Actuators (Sendai, Japan, 7-10 June 1999) , pp. 534
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9
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- Maskless etching of three-dimensional silicon structures in KOH
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- Li, X.¹ Bao, M.² Shen, S.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.