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Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films

Volumn 19, Issue 3, 2001, Pages 1004-1007

Absolute sputtering yield of Ti/TiN by Ar+/N+ at 400-700 eV

(4) Ranjan, R a Allain, J P a Hendricks, M R a Ruzic, D N a

a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; DIFFUSION; PHYSICAL VAPOR DEPOSITION; QUASICRYSTALS; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; THIN FILMS;

INTERCONNECTS; METALLIZATION;

TITANIUM NITRIDE;

EID: 0035335040 PISSN: 07342101 EISSN: None Source Type: Journal
DOI: 10.1116/1.1362678 Document Type: Article

Times cited : (38)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.