A cutting algorithm for optimizing the wafer exposure pattern

IEEE Transactions on Semiconductor Manufacturing

Volumn 14, Issue 2, 2001, Pages 157-162

  Chien, Chen Fu ^a   Hsu, Shao Chung ^b   Deng, Jing Feng ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b MACRONIX INTERNATIONAL CO LTD   (Taiwan)

Author keywords

Alogarithms; Gross yield optimization; Optimization methods; Two dimensional cutting; Wafer exposure pattern

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; CUTTING; DIES; ITERATIVE METHODS; OPTIMIZATION;

WAFER EXPOSURE PATTERN;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0035333336     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.920727     Document Type: Article

References (9)

1. An algebraic expression to count the number of chips on a wafer
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4. A linear programming approach to the cutting-stock problem
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6. A recursive computational procedure for container loading
7. Algorithms for unconstrained two-dimensional guillotine cutting
8. A DH/KD algorithm: A hybrid approach for unconstrained two-dimension cutting problems
9. The theory and computation of knapsack functions