An iterative cutting procedure for determining the optimal wafer exposure pattern

IEEE Transactions on Semiconductor Manufacturing

Volumn 12, Issue 3, 1999, Pages 375-377

  Chien, Chen Fu ^a   Hsu, Shao Chung ^b   Chen, Chin Ping ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b MACRONIX INTERNATIONAL CO LTD   (Taiwan)

Author keywords

Algorithms; Cutting; Optimization methods; Wafer exposure; Yield optimization

Indexed keywords

ALGORITHMS; COMPUTER SOFTWARE; CUTTING; EXPERT SYSTEMS; ITERATIVE METHODS; OPTIMIZATION; SILICON WAFERS;

ASM WAFER STEPPER; WAFER EXPOSURE; YIELD OPTIMIZATION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0033326954     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.778206     Document Type: Article

References (4)

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3. C.-F. Chien and W.-T. Wu, "A recursive computational procedure for container loading," Comput. Ind. Eng., vol. 35, pp. 319-322, Oct. 1998.
4. M. Hifi, "A DH/KD algorithm: A hybrid approach for unconstrained two-dimension cutting problems," Eur. J. Oper. Res., vol. 97, pp. 41-52, 1997.