Nondestructive inspection of delamination in IC packages by high-frequency microwaves

NDT and E International

Volumn 34, Issue 3, 2001, Pages 213-217

  Ju, Y ^a   Saka, M ^a   Abe H ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT TESTING; MICROWAVES;

INTEGRATED CIRCUIT PACKAGES;

NONDESTRUCTIVE EXAMINATION;

EID: 0035313269     PISSN: 09638695     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0963-8695(00)00059-1     Document Type: Article

References (9)

1. Tay A.A.O., Tan G.L., Lim T.B. Predicting delamination in plastic IC packages and determining suitable mold compound properties. IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B: Advanced Packaging. 17:(2):1994;201-208.
2. Lee H., Earmme Y.Y. A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks. IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A. 19:(2):1996;168-178.
3. Gopalsami N., Bakhtiari S., Dieckman S.L., Raptis A.C., Lepper M.J. Millimeter-wave imaging for nondestructive evaluation of materials. Materials Evaluation. 52:(3):1994;412-415.
4. Diener L. Microwave near-field imaging with open-ended waveguide - comparison with other techniques of nondestructive testing. Research in Nondestructive Evaluation. 7:(3):1995;137-152.
5. Qaddoumi N., Carriveau G., Ganchev S., Zoughi R. Microwave imaging of thick composite with defects. Materials Evaluation. 53:(8):1995;926-929.
6. Ju Y, Saka M, Abé H. Nondestructive evaluation of delamination in IC package utilizing microwave technique. In: Proceedings of the Third International Symposium on Electronic Packaging Technology. Beijing: Tsinghua University Press, 1998. p. 235-8.
7. Ju Y, Saka M, Abé H. Microwave imaging for nondestructive inspection of delamination in IC packages by open-ended coaxial line sensor. In: Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris. ASME, EEP-vol. 25, 1998. p. 265-70.
8. Ju Y., Saka M., Abé H. Microwave nondestructive detection of delamination in IC packages utilizing open-ended coaxial line sensor. NDT & E International. 32:(5):1999;259-264.
9. Ju Y, Saka M, Abé H. Microwave imaging for the integrity assessment of IC package. In: Proceedings of the Advances in Electronic Packaging 1999. Hawaii: ASME, EEP-vol. 26-1, 1999. p. 847-53.