Slow crack growth behavior in Si3N4 sintered with Yb2Si2O7 tie-line composition additives

Journal of the European Ceramic Society

Volumn 21, Issue 4, 2001, Pages 471-475

  Choi, Heon Jin ^a   Kim, Hyeong Jong ^a   Lee, June Gunn ^a   Kim, Young Wook ^b  

^a Korea Institute of Science and Technology   (South Korea)

^b University of Seoul   (South Korea)

Author keywords

Engine components; Grain boundaries; Si3N4; Sintering additives; Thermal properties

Indexed keywords

ALUMINUM COMPOUNDS; CRACK PROPAGATION; ELECTRIC RESISTANCE MEASUREMENT; GRANULAR MATERIALS; REFRACTORY MATERIALS; SILICON COMPOUNDS; STRESSES; YTTERBIUM COMPOUNDS;

INTERGRANULAR GLASSY FILMS;

CERAMIC MATERIALS;

CRACK PROPAGATION; GRAIN BOUNDARY; SILICON NITRIDE; SINTERING;

EID: 0035309652     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0955-2219(00)00218-1     Document Type: Article

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