Oxygen plasma resistance of low-k organosilica glass films

Electrochemical and Solid-State Letters

Volumn 4, Issue 3, 2001, Pages

  Furusawa, Takeshi ^a   Ryuzaki, Daisuke ^a   Yoneyama, Ryo ^a   Homma, Yoshio ^a   Hinode, Kenji ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; COMPOSITION EFFECTS; ELLIPSOMETRY; ETCHING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PERMITTIVITY; PLASMA APPLICATIONS; SEMICONDUCTING SILICON COMPOUNDS; STABILITY; STRUCTURE (COMPOSITION); THICKNESS MEASUREMENT; VOLTAGE MEASUREMENT;

ORGANOSILICA GLASS FILMS; OXYGEN PLASMA RESISTANCE; PLASMA RESISTANCE; SILICON OXYCARBIDE; WET ETCHING;

SEMICONDUCTING GLASS;

EID: 0035296663     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1347817     Document Type: Article

References (9)