New optomechanical technique for measuring layer thickness in MEMS processes

Journal of Microelectromechanical Systems

Volumn 10, Issue 1, 2001, Pages 153-157

  Marshall, J C ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Integrated microelectromechanical systems (iMEMS); Interferometry; Microelectromechanical systems (MEMS); Multiuser MEMS processes (MUMPs); Polysilicon; Profilometry; Test structures; Thickness

Indexed keywords

COMPUTATIONAL METHODS; INTERFEROMETRY; POLYSILICON; PROFILOMETRY;

OPTOMECHANICAL METHOD;

MICROELECTROMECHANICAL DEVICES;

EID: 0035279257     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.911104     Document Type: Article

References (9)

1. Surface micromachining for microelectromechanical systems
2. The resonant gate transistor
3. Fabrication technology for an integrated surface-micromachined sensor
4. Guidelines for evaluating and expressing the uncertainty of NIST measurement results
5. The depth measurement of craters produced by secondary ion mass spectrometry - Results of a stylus profilometry round-robin study
6. A new interferometric profiler for smooth and rough surfaces