Multifunctional structures for advanced spacecraft

Journal of Spacecraft and Rockets

Volumn 38, Issue 2, 2001, Pages 226-230

  Barnett, David M ^a   Rawal, Suraj ^a   Rummel, Kevin ^a  

^a LOCKHEED MARTIN SPACE SYSTEMS COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIGHT SIMULATORS; MICROELECTROMECHANICAL DEVICES; STRUCTURAL DESIGN; THERMAL LOAD;

MICROSPACECRAFTS; MULTIFUNCTIONAL STRUCTURES;

SPACECRAFT;

EID: 0035270301     PISSN: 00224650     EISSN: 15336794     Source Type: Journal    
DOI: 10.2514/2.3674     Document Type: Article

References (9)

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2. Sercel, J., Hanks, B., Boynton, W., Cassapakis, C., Crawley, E., Curcio, M., Das, A., Hayden, W., King, D., Peterson, L., Rawal, S., Reddy, T., and Sovie, J., "Modular and Multifunctional System in the New Millennium Program," AIAA Paper 96-0702, Jan. 1996.
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6. Bronowicki, A. J., Mendenhall, T. L., and Manning, R. M., "Advanced Composites with Embedded Sensors and Actuators (ACESA)," Astronautics Lab./U.S. Air Force Space Technology Center, Final Rept. AL-TR-89-086, April 1990.
7. DiChristina, M., "Deep Space Traveler," Popular Science, July 1998, pp. 42-47.
8. Arakaki, G., and Agostino, D. S., "New Millennium DS-2 Electronic Packaging Smaller, Faster with Managed Risk," IEEE Aerospace Conference Proceedings, IEEE Publications, Piscataway, NJ, 1998, pp. 1-8.
9. Rawal, S. P., Barnett, D. M., and Martin, D. E., "Thermal Management for Multifunctional Structures," IEEE Transactions on Advanced Packaging, Vol. 22, No. 3, 1999, pp. 379-383.