Thermal management for multifunctional structures

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 3, 1999, Pages 379-383

  Rawal, Suraj P ^a  

^a LOCKHEED MARTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MULTICHIP MODULES; TEMPERATURE CONTROL; THERMOANALYSIS;

MULTIFUNCTIONAL STRUCTURES (MFS);

AVIONICS;

EID: 0033325932     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.784489     Document Type: Article

References (7)

1. M. Obal and J. Sater, "Multifunctional structures: The future of spacecraft design?," in Proc. 5th Int. Conf. Adaptive Structures, Sendai, Japan, Dec. 5-7, 1994.
2. C. Nunez, "JPL spacecraft mass trends," Interoffice Memo 3132-93-076, Jet Propulsion Lab., Pasadena, CA, Feb. 19, 1993.
3. B. Muirhead, "Technology thrust areas for mass constrained spacecraft," in Proc. AIAA/DARPA Conf. Lightweight Satellite Syst., Naval Postgraduate School, Monterey, CA, Aug. 4-6, 1987.
4. J. Sercel et al., "Modular and multifunctional systems in the new millennium program," in Proc. AIAA-96-0702, 36th Aerosp. Sei. Meeting, Reno, NV, Jan. 15-18, 1996.
5. D. M. Barnett and S. Rawal, "Multifunctional structures technology experiment on deep space 1 mission," in Proc. 16th Digital Avionics Syst. Conf., 1997, pp. 2.3-1-2.3-7.
6. J. Chapter, "Honeycomb panel spacecraft radiator with multichip module thermal analysis and vacuum testing," in Proc. Space Technol. Appl. Int. Forum, pp. 801-812, 1997.
7. S. Rawal, "Thermal structural materials solutions for spacecraft applications," Monthly Lett. Rep. 18, submitted to AFRL/Wright Lab, Mar. 15, 1997.