Analysis of Ic spreads in interface engineered junctions

IEEE Transactions on Applied Superconductivity

Volumn 11, Issue 1 I, 2001, Pages 784-787

  Yoshida, J ^a   Inoue, S ^a   Sugiyama, H ^a   Nagano, T ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Interface engineered junction; Josephson junctions; Log normal distribution; Tunneling

Indexed keywords

ELECTRON TUNNELING; HIGH TEMPERATURE SUPERCONDUCTORS; RESONANT TUNNELING; SUPERCONDUCTING FILMS; WSI CIRCUITS; YTTRIUM BARIUM COPPER OXIDES;

INTERFACE ENGINEERED JUNCTIONS; TUNNEL BARRIER;

JOSEPHSON JUNCTION DEVICES;

EID: 0035268753     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.919462     Document Type: Conference Paper

References (7)

1. Margins and yields of SFQ circuits in HTS materials
2. c Josephson junction
3. High-temperature superconducting edge-type Josephson junctions with modified interfaces
4. Study of in-situ prepared superconducting edge-type Josephson junctions
5. Physics and technology of high temperature superconducting Josephson junctions
6. 7-d barriers
7. Transport processes in ramp-edge-type Josephson junctions