3D-MLSI: Software package for inductance calculation in multilayer superconducting integrated circuits

IEEE Transactions on Applied Superconductivity

Volumn 11, Issue 1 I, 2001, Pages 1090-1093

  Khapaev, Mikhail M ^a   Kidiyarova Shevchenko, Anna Yu ^b   Magnelind, Per ^b   Kupriyanov, Mikhail Yu ^c  

^a MOSCOW STATE UNIVERSITY   (Russian Federation)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c Microelectronics Dept   (Russian Federation)

Author keywords

Finite element method; Inductance; Sheet current; Stream function; Superconductivity

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; EQUIVALENT CIRCUITS; FINITE ELEMENT METHOD; INDUCTANCE MEASUREMENT; MAGNETIC FIELDS; MATHEMATICAL MODELS; SUPERCONDUCTIVITY; THREE DIMENSIONAL; USER INTERFACES;

MULTILAYER SUPERCONDUCTING INTEGRATED CIRCUITS; SOFTWARE PACKAGE 3D-MLSI; SOFTWARE PACKAGE ACAD; SOFTWARE PACKAGE CADENCE;

INTEGRATED CIRCUITS;

EID: 0035268078     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.919537     Document Type: Conference Paper

References (6)

1. Tools for the computer-aided design of multi-gigahertz superconducting digital circuits
2. Inductance extraction of multilayer finite thickness superconductor circuits
3. Extraction of inductances of plane thin film superconducting circuits
4. Ramp edge junction on a ground plane for RSFQ applications