Post-weld-shift in dual-in-line laser package

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 1, 2001, Pages 81-85

  Kuang, Jao Hwa ^b   Sheen, Maw Tyan ^b   Wang, Szu Chun ^c   Wang, Gow Ling ^b   Cheng, Wood Hi ^a,b  

^a IEEE

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^c CHUNGHWA TELECOM CO LTD   (Taiwan)

Author keywords

Finite element method; Post weld shift; Semiconductor laser packaging

Indexed keywords

COMPUTER SIMULATION; FIBER OPTICS; FINITE ELEMENT METHOD; INTEGRATED OPTOELECTRONICS; LASER BEAM WELDING; NEODYMIUM LASERS; RESIDUAL STRESSES; SEMICONDUCTOR LASERS; SHRINKAGE;

DUAL IN LINE PACKAGE; LASER PACKAGING; POST WELD SHIFT; THERMOELECTRIC COOLERS; THERMOPLASTICITY;

ELECTRONICS PACKAGING;

EID: 0035248441     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.909629     Document Type: Article

References (14)

1. Trends in laser packaging
2. Optical components-the new challenge in packaging
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4. Laser welding for fiber pig-tailing with long-term stability and submicron accuracy
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6. Packaging of photonic devices using laser welding
7. Effect of Au thickness on laser beam penetration in semiconductor laser packages
8. Crack formation mechanism in laser welded Au-coated materials for semiconductor laser packages
9. The principle cause of crack defects in optoelectronic materials with phosphorus-containing underlayer
10. Coupling and conversion coefficients for optical modes