Crack formation mechanism in laserwelded au-coated invar materials for semiconductor laser packaging

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 1, 1999, Pages 94-100

  Kuang, Jao Hwa ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Finite element method; Laser welding; Optoelectronic packaging; Segregation

Indexed keywords

EID: 0002668699     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.746548     Document Type: Article

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