Periodic reverse copper electroforming from a low Cu-content acid copper sulfate bath

Plating and Surface Finishing

Volumn 88, Issue 2, 2001, Pages 60-63

  Tajiri, Keisuke ^a   Imamura, Tsugio ^b  

^a MITSUBISHI HEAVY INDUSTRIES LTD   (Japan)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0004012551     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. W.H. Safranek, The Properties of Electrodeposited Metals & Alloys, 2nd ed., AESF, Orlando, FL, 1986; p. 111.
2. G.A. Malone, NASA CR-134959, NASA Lewis Research Center (1975); p. 10.
3. A.C. Hamilton Jr., Plat. and Surf. Fin., 84, 47 (Aug. 1977).
4. K. Tajiri, T. Nakamura, Z. Kabeya, Y. Yamanaka, F. Naito, T. Kato & E. Takasaki, 15th Int'l INTERFINISH Congress, Germany, (Sept. 2000).
5. K. Tajiri, Y. Yamanaka, F. Naito, T. Kato & E. Takasaki, Proc. AESF/SFSJ Advanced Surface Technology Forum, 145, AESF, Orlando, FL (1998).