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Journal of Thermal Analysis and Calorimetry

Volumn 66, Issue 1, 2001, Pages 223-232

Thermal behaviour of silver-filled epoxy adhesives. Technological implications in microelectronics

(3) Damasceni, A a Dei, L a Guasti, F b

a UNIVERSITY OF FLORENCE (Italy)

b LABEN SpA (Italy)

Author keywords

Curing; DMTA; DSC; Epoxy adhesives; Polymerisation; Tg

Indexed keywords

ADHESIVES; CURING; DYNAMIC MECHANICAL ANALYSIS; MICROELECTRONICS; POLYMERIZATION; THERMOANALYSIS;

EPOXY ADHESIVES;

DIFFERENTIAL SCANNING CALORIMETRY;

EID: 0035171006 PISSN: 14182874 EISSN: None Source Type: Journal
DOI: 10.1023/A:1012404218926 Document Type: Conference Paper

Times cited : (6)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.