Thermal analysis in the development of self validating adhesives

Thermochimica Acta

Volumn 315, Issue 1, 1998, Pages 67-75

  Allsop, N A ^a   Bowditch, M R ^a   Glass, N F C ^a   Harris, A E ^a   O'Gara, P M ^a  

^a DEFENCE SCIENCE AND TECHNOLOGY LABORATORY   (United Kingdom)

Author keywords

Epoxy resin; Kissing bond; Physical ageing; Smart materials; Zero volume unbond

Indexed keywords

EID: 0006561391     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6031(98)00278-0     Document Type: Article

References (5)

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2. C. Dry, N.R. Sottos, Proc. SPIE: Smart Structures and Materials, 1993, 438.
3. Cowie J.M.G. Eur. Polym. J. 11:1973;297.
4. Hutchinson J.M., McCarthy D., Monserrat S., Cortes P. J. Polym. Sci.: Part B: Polym. Phys. 34:1996;229-239.
5. L.C.E. Struiuk, Physical Ageing of Amorphous Polymers and other Materials, Elsevier, Amsterdam, 1978.