Detection of delamination in IC packages using the phase of microwaves

NDT and E International

Volumn 34, Issue 1, 2001, Pages 49-56

  Ju, Y ^a   Saka, M ^a   Abe H ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT TESTING; MICROSENSORS; MICROWAVES; SENSITIVITY ANALYSIS;

COAXIAL LINE SENSORS;

NONDESTRUCTIVE EXAMINATION;

EID: 0035151457     PISSN: 09638695     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0963-8695(00)00044-X     Document Type: Article

References (7)

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2. Lee H., Earmme Y.Y. A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks. IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A. 19:(2):1996;168-178.
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