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Volumn 201, Issue 2, 2001, Pages 230-237
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Microcracking mechanism in a SiCf-SiBC composite creep-tested in argon
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Author keywords
Damage creep; Interfaces; Multilayered matrix; SiCf SiBC; Transmission electron microscopy
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Indexed keywords
ARGON;
CREEP;
ELECTRONS;
HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY;
MICROCRACKS;
CREEP BEHAVIORS;
CREEP CURVES;
CREEP MECHANISM;
CREEP STRAIN;
DAMAGE-CREEP;
DEFORMATION MECHANISM;
HIGH RESOLUTION;
HIGHEST TEMPERATURE;
MULTILAYERED MATRIX;
SICF-SIBC;
SCANNING ELECTRON MICROSCOPY;
ARGON;
SILICON;
ARTICLE;
CERAMICS;
PHYSICAL PHASE;
PRIORITY JOURNAL;
SCANNING ELECTRON MICROSCOPY;
THERMODYNAMICS;
TRANSMISSION ELECTRON MICROSCOPY;
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EID: 0035090887
PISSN: 00222720
EISSN: None
Source Type: Journal
DOI: 10.1046/j.1365-2818.2001.00771.x Document Type: Article |
Times cited : (8)
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References (24)
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