Conformality of chemical-vapor-deposited tungsten on TiN prepared by metal-organic chemical vapor deposition via cyclic plasma treatment

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 40, Issue 1, 2001, Pages 265-268

  Whang, Soon Hong ^a   Kim, Jun Ki ^a   Park, Jin Won ^a   Kim, Do Heyoung ^b   Cho, Dong Lyun ^b   Lee, Wan Jin ^b  

^a Central Research Laboratory   (South Korea)

^b Chonnam National University   (South Korea)

Author keywords

Annealing; Chemical vapor deposition; Conformality; TDMAT; TiN; W

Indexed keywords

ANNEALING; CONFORMATIONS; PHYSICAL VAPOR DEPOSITION; PLASMA APPLICATIONS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

COLLIMATED SPUTTERING; CYCLIC PLASMA TREATMENT;

METALLIC FILMS;

EID: 0035061885     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.40.265     Document Type: Article

References (7)