Metallization of CVD diamond films by ion beam assisted deposition

Materials Chemistry and Physics

Volumn 62, Issue 3, 2000, Pages 241-246

  Tjong, S C ^a   Wong, N B ^a   Li, G ^b   Lee, S T ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; CHEMICAL VAPOR DEPOSITION; GOLD ALLOYS; ION BEAMS; METALLIC FILMS; METALLIZING; NICKEL; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SUBSTRATES; TITANIUM;

ION BEAM ASSISTED DEPOSITION;

DIAMOND FILMS;

EID: 0033881216     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(99)00175-3     Document Type: Article

References (24)

1. Clay F.A., Panaousis N.T., Pierce R.W. Jr. IEEE Trans. Compon., Hybrids Manuf. Technol. 10:1974;258.
2. Moazed K.L., Zeidler J.R., Taylor M.J. J. Appl. Phys. 68:1990;2246.
3. Gildenblat G.S., Grot S.A., Badzian A. Proc. IEEE. 79:1991;647.
4. Hewett C.A., Zeidler J.R. Diamond Rel. Mater. 2:1993;1319.
5. Katz A., Lee C.H., Tai K.L. Mater. Chem. Phys. 37:1994;303.
6. Lau J.H., Rice D.W. Solid State Technol. 28:1985;91.
7. Knecht S., Fox L.R. IEEE Trans. Compon., Hybrids Manuf. Technol. 13:1990;424.
8. Lee C.C., Wang C.Y., Matijasevic G.S. IEEE Trans. Compon., Hybrids Manuf. Technol. 14:1991;407.
9. Iacovangelo C.D. Thin solid Films. 286:1996;264.
10. Lee C.H., Wong Y.M., Doherty C., Tai K.L., Katz A., Lane E., Bacon D.D., Baiocchi F. J. Appl. Phys. 72:1992;3808.
11. Katz A., Baiocchi F., Lane E., Lee C.H., Hall C., Doting J., Grijsbach C., Harris K. J. Appl. Phys. 75:1994;563.
12. Vilojen P.E., Lambers E.S., Holloway P.H. J. Vac. Sci. Technol. B. 12:1994;2997.
13. Tachibana T., Williams B.E., Glass J.T. Phys. Rev. B. 45:1992;11975.
14. Li G., Su X., Gong Z., Liu B., Wen X., Ma T. Surface Coat. Technol. 66:1994;350.
15. Muller K.H. J. Appl. Phys. 62:1987;1796.
16. Rossnagel S.M. J. Vac. Sci. Technol. A. 7:1989;1025.
17. Roy R.A., Petkie R., Boulding A. J. Mater. Res. 6:1991;80.
18. Yang J., Wang C., Tao K., Fan Y. J. Vac. Sci. Technol. A. 13:1995;481.
19. He X., Yang S.Z., Tao K., Fan Y. J. Mater. Res. 12:1997;846.
20. Maynard I., Venkatesan V., von Windheim J.A., Thompson D.G. Thin Solid Films. 238:1994;37.
21. N.B. Wong, G.Q. Li, S.C. Tjong, S.T. Lee, J. Electron. Mater., submitted for publication.
22. L. Doolitle, RUMP RBS Simulation Program, Computer Graphics Service Ltd., 1993.
23. Benjamin P., Weaver C. Proc. Royal. Soc. Lond. A. 254:1960;163.
24. Perry S.S., McGinnis S.P., Somorjai G.A. J. Adhesion Sci. Technol. 9:1995;711.