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Volumn 23, Issue 2, 1997, Pages
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PWB build-up technologies: smaller, thinner and lighter
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Author keywords
[No Author keywords available]
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Indexed keywords
COST EFFECTIVENESS;
ELECTRONICS PACKAGING;
MATERIALS HANDLING;
PHOTOLITHOGRAPHY;
SURFACE TREATMENT;
TECHNOLOGY;
BOARD DENSITY;
BOARD THICKNESS;
NONDRILLED VIAS;
PRINTED WIRING BOARDS;
SURFACE FINISHES;
PRINTED CIRCUIT MANUFACTURE;
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EID: 0030813277
PISSN: 03056120
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (5)
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References (5)
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