Methods for achieving high speed acid copper electroplating in the PCB industry

Circuit World

Volumn 27, Issue 3, 2001, Pages 19-25

  Cobley, A J ^a   Gabe, D R ^b  

^a SHIPLEY COMPANY   (United States)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Copper plating; Electroplating; Printed circuits

Indexed keywords

COPPER PLATING; CURRENT DENSITY; ELECTROCHEMISTRY; ELECTROPLATING; MICROELECTRONICS; PRINTED CIRCUIT BOARDS;

ACID COPPER ELECTROPLATING; ELECTROLYTE CHEMISTRY; HORIZONTAL CONVEYORISED TECHNIQUES;

PRINTED CIRCUIT MANUFACTURE;

EID: 0034944131     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120110385465     Document Type: Article

References (10)