Flat micro heat pipe arrays for cooling and thermal management at the package level

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4408, Issue , 2001, Pages 424-429

  Park, J S ^a   Choi, J H ^a   Cho, H C ^a   Yang, S S ^a   Yoo, J S ^a  

^a Ajou University   (South Korea)

Author keywords

Capillary; Cooling; Micro heat pipe; Package; Thermal management

Indexed keywords

HEAT PIPES; HEAT TRANSFER; MICROELECTRONICS; THERMAL CONDUCTIVITY; TWO PHASE FLOW; VAPORIZATION;

FLAT MICRO HEAT PIPES (FMHP);

ELECTRONICS PACKAGING;

EID: 0034867336     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.425361     Document Type: Article

References (5)

1. Improved heat sinking for laser-diode arrays using microchannles in CVD diamond
2. Heat-pipe cooling technology for high-speed ATM switching multichip modules
3. Thermo-electro- mechanical refrigeration using transient thermoelectric effects
4. Micro heat exchanger by using MEMS impinging jets
5. Modeling, fabrication, and testing of micro heat pipes: An update