Wafer scale packaging for a MEMS video scanner

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4407, Issue , 2001, Pages 214-220

  Helsel, M P ^a   Barger, J D ^a   Wine, D W ^a   Osborn, T D ^a  

^a NONE

Author keywords

Glass frit; Video scanner; Wafer bonding; Wafer scale packaging

Indexed keywords

DISPLAY DEVICES; MICROELECTROMECHANICAL DEVICES; SCANNING; SEALING (CLOSING); SUBSTRATES;

VIDEO SCANNER;

ELECTRONICS PACKAGING;

EID: 0034851835     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.425304     Document Type: Conference Paper

References (11)

1. Performance of a biaxial MEMS-based scanner for microdisplay applications
2. Silicon wafer bonding: Key to MEMS high volume manufacturing
3. Bonding of silicon wafers for silicon-on-insulator
4. Generalized reaction bonding
5. In sim investigation of precise high strength micro assembly using Au-Si eutectic bonding
6. Low temperature wafer bonding
7. Bonding techniques for microsensors
8. Low-temperature silicon-to-silicon bonding with intermediate low melting point glass
9. Characterization of low temperature, Wafer-level gold-gold thermocompression bonds
10. Advantages of scanned beam MOEMS approach to microdisplay and related applications