An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy

Conference Record - IEEE Instrumentation and Measurement Technology Conference

Volumn 1, Issue , 2001, Pages 65-70

  Bechou, L ^a   Dallet, D ^a   Danto, Y ^a   Daponte, P ^b   Ousten, Y ^a   Rapuano, S ^b  

^a UNIVERSITÉ BORDEAUX 1   (France)

^b UNIVERSITY OF SANNIO   (Italy)

Author keywords

Continuous wavelet transform; Scanning acoustic microscopy; Wiener filtering

Indexed keywords

ALGORITHMS; DEFECTS; DIGITAL SIGNAL PROCESSING; MICROELECTRONICS; SCANNING; ULTRASONIC MEASUREMENT; WAVELET TRANSFORMS;

CONTINUOUS WAVELET TRANSFORMS; SCANNING ULTRASONIC MICROSCOPY; ULTRASONIC SIGNALS; WIENER FILTERING;

MICROSCOPIC EXAMINATION;

EID: 0034837938     PISSN: None     EISSN: None     Source Type: Journal    
DOI: 10.1109/IMTC.2001.928789     Document Type: Article

References (16)

1. Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips
2. Die attach materials and methods
3. The detection of echoes from multilayer structures using the wavelet transform
4. Thin thickness measurement by means of a wavelet transform based method
5. A method for the automatic detection and measurement of transients. Part I: The measurement method
6. A method for the automatic detection and measurement of transients. Part II: Applications
7. Flaw signature estimation in ultrasonic nondestructive evaluation using the wiener filter with limited prior information
8. Ultrasonic range resolution enhancement using L1 norm deconvolution
9. De-noising of high-resolution ECG signals by combining the discrete wavelet transform with the Wiener filter
10. Wiener filter design using polynomial equations
11. An iterative method for designing separable Wiener filters
12. Blind Wiener filtering: Estimation of a random signal in noise using little prior knowledge
13. Un algoritmo per la preelaborazione di segnali ultrasonici per la rilevazione di difetti in assemblaggi microelecttronici
14. Localization of defects in die-attach assembly by Continuous Wavelet Transform using scanning acoustic microscopy