Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1040-1044

  Luk, C F ^a   Chan, Y C ^b   Hung, K C ^b  

^a SAE Magnetics (HK) Ltd   (Hong Kong)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HARD DISK STORAGE;

FLIP CHIP BONDING; GOLD TO GOLD INTERCONNECTION; HARD DISK DRIVES; INTEGRATED CIRCUIT SUPPRESSION;

MICROPROCESSOR CHIPS;

EID: 0034835762     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00256-6     Document Type: Article

References (4)

1. Chip-on-suspension electronics close preamp head gap