A new low temperature curing prepreg

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 46 II, Issue , 2001, Pages 2293-2302

  Mitani, K ^a   Wakabayashi, K ^a   Hayashi, S ^a  

^a MITSUBISHI CHEMICAL CORPORATION   (Japan)

Author keywords

Low temperature cure; Prepregs; Vacuum bagging

Indexed keywords

COST EFFECTIVENESS; HEAT RESISTANCE; LOW TEMPERATURE EFFECTS; MOLDING; VACUUM APPLICATIONS;

LOW TEMPERATURE CURING; PREPEGS;

CURING;

EID: 0034835270     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)