Cycom X5215 - an epoxy prepreg that cures void free out of autoclave at low temperature

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 43, Issue 1, 1998, Pages 9-19

  Xu, Guo Feng ^a   Repecka, Linas ^a   Boyd, Jack ^a  

^a CYTEC INDUSTRIES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; LAMINATED COMPOSITES; LOW TEMPERATURE PROPERTIES; MECHANICAL PROPERTIES; VACUUM APPLICATIONS;

PREPREGS; VACUUM BAGS;

EPOXY RESINS;

EID: 0031621679     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)