SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1227-1232

A new coiled microspring contact technology

a Murray Hill Devices Inc (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELASTIC MODULI; ELECTRIC COILS; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; PHOTOLITHOGRAPHY; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; THERMAL EFFECTS; THIN FILM DEVICES;

ELASTIC COMPRESSION; IRREVERSIBLE THERMAL CURVING; MICROSPRING CONTACT TECHNOLOGY; THIN FILM METAL BIMORPHS; WAFER-STAGE FABRICATION;

OHMIC CONTACTS;

EID: 0034829991 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (9)

References (10)

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4
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8
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.