Full wave analysis of planar interconnect structures using FDTD-SPICE

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 489-494

  Orhanovic, N ^a   Raghuram, R ^a   Matsui, N ^a  

^a Applied Simulation Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CONDUCTORS; ELECTRIC POWER SUPPLIES TO APPARATUS; EQUIVALENT CIRCUITS; FINITE DIFFERENCE METHOD; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SKIN EFFECT; TIME DOMAIN ANALYSIS;

FINITE DIFFERENCE TIME DOMAIN METHOD; PLANAR INTERCONNECT STRUCTURES;

INTERCONNECTION NETWORKS;

EID: 0034829255     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Enhanced skin effect for partial-element equivalent-circuit models
2. Improved global rational approximation marcomodeling algorithm for networks characterized by frequency-sampled data
3. Laguerre-SVD reduced-order modeling
4. Extending the two-dimensional FD-TD method to hybrid electromagnetic systems with active and passive limped elements
5. The use of SPICE lumped circuits as sub-grid models for FDTD analysis
6. Modeling of microwave active devices using the FDTD analysis based on the voltage-source approach
7. Global modeling of microwave applications by combining the FDTD method and a general semiconductor device and circuit simulator
8. Ground bouncing in PCB with integrated circuits
9. A surface impedance approach for modeling transmission line losses in FDTD
10. Automatic generation of spice macromodels from N-port parameters