The comparison of solder joint reliability between BCC++ and QFN

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1052-1058

  Hung, S C ^a   Zheng, P J ^a   Ho, S H ^a   Lee, S C ^a   Wu, J D ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Bend to fail test; Board level reliability; Cyclic bending and failure analysis; Drop test; Shear test; Thermal cycling

Indexed keywords

BENDING STRENGTH; FAILURE ANALYSIS; FATIGUE TESTING; RELIABILITY; SHEAR STRENGTH; THERMAL CYCLING;

BEND TO FAIL TEST; BOARD LEVEL RELIABILITY; CYCLIC BENDING; DROP TEST;

SOLDERED JOINTS;

EID: 0034822320     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
2. Board level reliability of CSP
3. Key factors in chip-scale package assembly reliability
4. A test strategy to verify the reliability of chip-scale packages
5. Board level reliability of chip scale packages
6. Board level reliability of chip scale packages
7. Development of BGA solder joint vibration fatigue life prediction model
8. Solder joint reliability of flip chip and plastic ball grid array assembleis under thermal, mechanical, and vibration conditions
9. Mechanical cycling fatigue of PBGA package interconnects
10. Reliability and failure analyses of PBGA assemblies under bending cyclic test