Kinetics of 4,4′-Diaminodiphenylmethane Curing of Bisphenol-S Epoxy Resin

Journal of Applied Polymer Science

Volumn 73, Issue 9, 1999, Pages 1799-1803

  Li, Yanfang ^a   Shen, Shigang ^a   Liu, Yanfang ^a   Gao, Jungang ^a  

^a HEBEI UNIVERSITY   (China)

Author keywords

4,4 diammodiphenylmethane; Bisphenol S epoxy resin; Cure reaction; Differential scanning calorimetry; Kinetics

Indexed keywords

EID: 0001299944     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19990829)73:9<1799::AID-APP23>3.0.CO;2-Y     Document Type: Article

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