An automated method for overlay sample plan optimization based on spatial variation modeling

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4344, Issue 1, 2001, Pages 257-266

  Chen, Xuemei ^a   Preil, Moshe E ^a   Le Goff Dussable, Mathilde ^b   Maenhoudt, Mireille ^b  

^a KLA TENCOR CORPORATION   (United States)

^b IMEC   (Belgium)

Author keywords

Generalized nested ANOVA; Lithography Process Control; Overlay Metrology; Sampling; Spatial Variation

Indexed keywords

CHEMICAL MECHANICAL POLISHING; ERROR ANALYSIS; LITHOGRAPHY; OPTIMIZATION; SAMPLING;

SPATIAL VARIATION MODELING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034762589     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.436749     Document Type: Article

References (2)

1. Impact of stepper overlay on advanced design rules
2. Critical dimension sample planning for sub-0.25 micron processes