Parametric study of metal droplet deposition and solidification process including contact resistance and undercooling effects

International Journal of Heat and Mass Transfer

Volumn 44, Issue 3, 2001, Pages 605-618

  Chung, Mo ^a,b   Rangel, R H ^a  

^a University of California at Irvine   (United States)

^b Yeungnam University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; DROP FORMATION; INTERFACES (MATERIALS); MATHEMATICAL MODELS; SOLIDIFICATION;

METAL DROPLET DEPOSITION; UNDERCOOLING EFFECTS;

HEAT TRANSFER;

DEPOSITION; DROPLET; METAL; SOLIDIFICATION;

EID: 0034746714     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0017-9310(00)00112-5     Document Type: Article

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